In an attempt to raise the copper grade of Printed Circuit board (PCB) by removing other components, carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under nitrogen atmosphere. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The liberation of copper foil from the oversized pieces was also investigated. The copper foil was liberated easily from glass fiber by stamping treatment. Liberation rate of copper foil was high at high carbonized temperature. The experimental results indicated that 90% of oversized char was liberated and the copper foil recovery from PCB carbonized at 1073 K was 110 kg/t. The copper recovery from char powder by flotation was also investigated. 15% of the copper grade and 80% of the copper recovery were obtained.