表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
研究論文
無電解捕集/ストリッピングボルタンメトリーによる銅電解液中の微量塩化物イオンの定量
栗原 美穂薦田 康夫端 洋志白樫 高史加藤 貞二
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2004 年 55 巻 2 号 p. 145-150

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A new method using non-electrolytic deposition/stripping voltammetry was developed for determining trace amounts of chloride ion in the order of 0.1mg L-1 in copper electrolyte solutions. It was found, using a silver electrode as the working electrode, that when the electrode was immersed for a certain time in an agitated copper electrolyte solution containing a certain amount of Fe(III) ion, a quantitative amount of chloride ion could be spontaneously collected without applying electric potential. Then the deposited silver chloride on the silver electrode was stripped. One cycle of measurement of this method took approximately 10min, and the relative standard deviation of the measurements of 0.5mg L-1 chloride ion in a synthetic copper electrolyte solution was 2.0%(n=10). The effect of coexistent substances was examined. The measured concentration of chloride ion was influenced by changes of concentrations of copper (II) ion, sulfuric acid and iron(III) ion. Then, a calibration method using the standard addition method was examined. The time required for the whole procedure of the standard addition method was approximately 60min, and the relative standard deviation of the measurement of chloride ion in diluted copper electrolyte solution was 5.6% (n=6).

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© 2004 一般社団法人 表面技術協会
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