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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Corrosion reliability of copper wirebond (CuWB) packages-Impact of voltage and corrosive ions from packaging materials
Varughese Mathew
,
Sheila Chopin
,
Copper wirebond
mold compounds
high temperature reliability
corrosion
electronic package
•
https://doi.org/10.4071/isom-2015-WA51
IMAPSource Conference Papers
Mathew, Varughese, and Sheila Chopin. 2015. “Corrosion Reliability of Copper Wirebond (CuWB) Packages-Impact of Voltage and Corrosive Ions from Packaging Materials.”
IMAPSource Proceedings
2015 (1): 286–91.
https://doi.org/10.4071/isom-2015-WA51
.
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