Test Vehicle for Studying Thermal Conductivity of Die Attach Adhesives for High Temperature Electronics

Conor Slater; Fabrizio Vecchio; Thomas Maeder; Peter Ryser

doi:10.4028/www.scientific.net/SSP.188.238

Paper Titles

Viscoelastic Properties of Semi-Crystalline Thermoplastic Polymers: Dynamic Analysis and Creep
p.211

Indentation in F.C.C. Single Crystals
p.219

Experimental Study of Bimaterial Shear Strength and Strain Concentrations by Iosipescu Based Test Using Digital Image Correlation System
p.226

Modeling and Prediction of Mechanical Behavior of Plastic Gears in Simulated Wear Situation
p.232

Test Vehicle for Studying Thermal Conductivity of Die Attach Adhesives for High Temperature Electronics
p.238

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging
p.244

Finite-Element Analysis of Forces in Drilling of Ti-Alloys at Elevated Temperature
p.250

Durability Study of a Machine Shaft Based on the Material Behavior of 41Cr4 Steel Subjected to Rotating Bending
p.256

Stress Evaluation by Neutron and Synchrotron Radiation
p.262

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Test Vehicle for Studying Thermal Conductivity of Die Attach Adhesives for High Temperature Electronics

Abstract:

Polymer adhesives offer a viable method for mounting silicon dies for high temperature applications. Here a test vehicle for comparing the thermal conductivity of different die attach materials is presented. The setup can be used to determine the degree of degradation of polymers. It consists of a mock die that has an integrated thick film heater, which is mounted onto a substrate. In operation, the substrate is placed on a heatsink and the die is heated. When the temperature reaches equilibrium the heater is switched off and the temperature of the die is measured as it cools. The time constant of the temperature decay is calculated to give the thermal conductivity. In this paper the thermal conductivity of an epoxy die attach adhesive is compared to its shear strength.

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Periodical:

Solid State Phenomena (Volume 188)

Pages:

238-243

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.188.238

Citation:

Cite this paper

Online since:

May 2012

Authors:

Conor Slater, Fabrizio Vecchio, Thomas Maeder, Peter Ryser

Keywords:

Die Attach, Electronics, High-Temperature, Thermal Conductivity (TC)

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