Etching of Silicon Dioxide with Gas Phase HF and Water: Initiation, Bulk Etching, and Termination.
p.3
p.3
Evaluation of the Plasmaless Gaseous Etching Process
p.7
p.7
Single Wafer Hydrophobic Surface Preparation on 300mm by HF Vapor
p.11
p.11
Insights into HF-Last Processes and Particle Performance in a Single Wafer Spin Cleaning Tool
p.15
p.15
Implementing an In Situ Surface Preparation Prior to Ni Deposition for Ni Salicide Processes
p.19
p.19
Electrical Impact of Various Arsenic-Residues Cleanings
p.23
p.23
Elimination of Watermark on Extremely High-Doped Poly-Silicon Surfaces Using HF-Vapor Cleaning
p.27
p.27
Passivation Studies of Germanium Surfaces
p.33
p.33
Germanium Surface Passivation Using Ozone Gaseous Phase
p.37
p.37
Implementing an In Situ Surface Preparation Prior to Ni Deposition for Ni Salicide Processes
Abstract:
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Info:
Periodical:
Solid State Phenomena (Volume 134)
Pages:
19-22
Citation:
Online since:
November 2007
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