Flow Stress Modelling and Microstructure Development during Deformation of Metallic Materials

Johannes Kreyca; Ernst Kozeschnik

doi:10.4028/www.scientific.net/MSF.892.44

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HomeMaterials Science ForumMaterials Science Forum Vol. 892Flow Stress Modelling and Microstructure...

Flow Stress Modelling and Microstructure Development during Deformation of Metallic Materials

Abstract:

A constant strain hardening rate is characteristic for large strain deformation at low temperatures and often observed during wire drawing. This stage of deformation, in the following referred to as stage IV, is determined by the microstructural evolution of dislocation cells. At elevated temperatures, rapid stress saturation is typically reached and no stage IV behavior is observed. This behavior is modelled in the present work, following the concept of state-parameter based plasticity, evolving dislocation density and subgrain formation as functions of strain rate, strain and temperature. It is demonstrated that the temperature dependence of state parameters at different deformation stages is closely related. The present model is compared to a series of compression tests carried out on a Gleeble 1500 thermo-mechanical simulator. EBSD micrographs of the same material reveal the microstructural evolution during plastic deformation. It is shown experimentally that the transition from cell forming behavior to subgrain formation correlates well with the disappearance of stage IV and the overall change in the dominant mechanism for overcoming obstacles. In combination with thermally activated yield stress prediction, this model, recently implemented in the software package MatCalc, offers a powerful tool for flow-curve simulation.

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Periodical:

Materials Science Forum (Volume 892)

Pages:

44-49

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.892.44

Citation:

Cite this paper

Online since:

March 2017

Authors:

Johannes Kreyca*, Ernst Kozeschnik

Keywords:

Large Deformation, Stage IV, State-Parameter

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Creative Commons CC BY 4.0

* - Corresponding Author

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