CIMOSFET: A New MOSFET on SiC with a Superior Ron·Qgd Figure of Merit

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Abstract:

A new MOSFET structure named the CIMOSFET (Central Implant MOSFET) has been presented and experimentally confirmed on SiC. The novelty of the CIMOSFET lies in a p-type implant introduced in the middle of the JFET area to shield the oxide interface field from the drain bias. Compared to the commercially available 1200 V SiC DMOSFET, this new concept has significantly reduced the on-resistance (Ron) and gate-drain capacitance (Cgd) simultaneously, produced a record low Ron·Qgd Figure of Merit of 455 mΩ·nC at 25°C, and 700 mΩ·nC at 150°C (~30% of the best data found). Only a 55% increase in Ron from 25°C to 150°C has been achieved due to the highly doped drift layer used on the CIMOSFET. Inductive load switching measurements have shown the CIMOSFET exhibits a fast switching performance. The CIMOSFET blocks 1600 V even though its drift doping is higher than that of the conventional DMOSFETs.

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Periodical:

Materials Science Forum (Volumes 821-823)

Pages:

765-768

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Online since:

June 2015

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[1] Q. Zhang, R. Callanan, M. Das, S-H. Ryu, A. Agarwal, and J. W. Palmour, SiC power devices for microgrids, IEEE Trans. Power Electronics, 25 (12) 2889-2896 (2010).

DOI: 10.1109/tpel.2010.2079956

Google Scholar

[2] K. Okumura, N. Hase, K. Ino, T. Nakamura, and M. Tanimura, Ultra low on-resistance SiC trench devices, Power Semiconductors, Issue 4, 22-24 (2012).

Google Scholar

[3] R. Kosugi, Y. Sakuma, K. Kojima, S. Itoh, A. Nagata, T. Yatsuo, Y. Tanaka, and H. Okumura, First experimental demonstration of SiC super-junction (SJ) structure by multi-epitaxial growth method, Proc. of the 26th Inter. Sym. on Power Semi. Dev. & Ics (ISPSD), 246-349 (2014).

DOI: 10.1109/ispsd.2014.6856047

Google Scholar