Development of W/Cu Plasma Facing Component for Fusion Device

Fa Li Chong

doi:10.4028/www.scientific.net/MSF.809-810.750

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HomeMaterials Science ForumMaterials Science Forum Vols. 809-810Development of W/Cu Plasma Facing Component for...

Development of W/Cu Plasma Facing Component for Fusion Device

Abstract:

Tungsten was considered a promising plasma facing material in fusion device due to its high sputtering threshold, the high melting point,and so on. Several technologies fabricated tungsten armor on copper substrate were introduced, which included plasma sprayed tungsten coating, W/Cu functionally gradient material and the dispersiion strengtheded W alloys (W-TiC, W-La₂O₃). Meanwhile, W-Cu mock-up with the different compliant interlayers was optimizated by means of ANSYS code.

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2014 China Functional Materials Technology and Industry Forum

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Periodical:

Materials Science Forum (Volumes 809-810)

Pages:

750-756

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.809-810.750

Citation:

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Online since:

December 2014

Authors:

Fa Li Chong*

Keywords:

Plasma Facing Component, Tungsten

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* - Corresponding Author

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