Study on Copper Nitride Thin Films Prepared by Reactive DC Magnetron Sputtering

Xing Ao Li; Jian Ping Yang; Yong Tao Li; Li Xia Wang; Hai Yun Wang

doi:10.4028/www.scientific.net/MSF.687.706

Paper Titles

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Microstructure and Magnetic Properties of FePt/Ag Nanocomposite Films with Perpendicular Orientation
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Microstructure and Mechanical Properties of CrAlTiCN Multilayer Films by Magnetron Sputtering Ion Plating
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Study on Copper Nitride Thin Films Prepared by Reactive DC Magnetron Sputtering
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Optically Transparent of N-ZnO/p-NiO Heterojunction for Ultraviolet Photodetector Application
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Postdeposition Thermal Annealing Influence on the Activation of the Cosputtered AlN-ZnO Films
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Preparation and Characterization of Diamond-TiC-Ti-Ag/Cu Gradient Metallization System
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Preparation and Electrochemical Properties of NiO Thin Films by Sol-Gel
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HomeMaterials Science ForumMaterials Science Forum Vol. 687Study on Copper Nitride Thin Films Prepared by...

Study on Copper Nitride Thin Films Prepared by Reactive DC Magnetron Sputtering

Abstract:

Copper nitride thin films were deposited on glass substrates by reactive DC magnetron sputtering at various N₂-gas flow rates and different substrate temperature. X-ray diffraction measurements show that the films are composed of Cu₃N crystallites with anti-ReO₃ structure and exhibit preferential orientation to the [111] and [100]. The preferred crystalline orientation of the films changes with the N₂-gas flow rate and substrate temperature. The N₂-gas flow rate and the substrate temperature not only affect the crystal structure of films but also affect the deposition rate, the resistivity and the microhardness of the Cu₃N films.