Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper

Ya Wen Lin; Jui Chao Kuo; Kuan Tai Lui; Delphic Chen

doi:10.4028/www.scientific.net/MSF.638-642.2841

Paper Titles

The Effects of Different Precipitation States on the Annealing Behaviour of AA6111
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Texture and Strain Experiments at OPAL
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Microstructure and Texture Optimization in Fe-Si Ferritic Steels
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Texture and Substructure Development during Dynamic Recrystallization in Ni-30Fe Austenite
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Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper
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A Variant Selection Rule in Transformation in Steel and Prediction of Transformation Texture
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Structure/Property Relationship in Intergranular Corrosion of Archaeological Silver Artefacts
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Grain Boundary Sliding Phenomenon and Its Effect on High Temperature Ductility of Ni-Base Alloys
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Relations of Initial Microstructure with Grain Boundary Character Distributions in a Cold Rolled and Annealed Lead Alloy
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HomeMaterials Science ForumMaterials Science Forum Vols. 638-642Effect of Plating Current Density and Frequency on...

Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper

Abstract:

For interconnect materials in the microelectronic technology copper has replaced aluminum due to its lower resistivity, higher thermal conductivity and better electromigration resistance. Recently, it was found that nanotwinned copper exhibits ultra high yield strength, ductility and electrical conductivity. Therefore, in this study the effect of plating current density and frequency were investigated on the crystallographic texture of Cu electrodeposited to understand the twin character. Electron backscatter diffraction (EBSD) was used for characterizing the preferred orientation, grain size distribution, and grain boundary character distribution. Three kinds of <110>, <111> and <112> textures were found to be related with the electrodeposited parameters of current density and frequency. Here we will discuss the relationship between the preferred orientation and the electrodeposited parameters.