Directional Solidification of Undercooled Hypoeutectic Silver-Copper Alloy Melt

Yu Ying Lu; Hong Xing Zheng; Fa Qin Xie; Jian Guo Li

doi:10.4028/www.scientific.net/MSF.475-479.2607

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Directional Solidification of Undercooled Hypoeutectic Silver-Copper Alloy Melt
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HomeMaterials Science ForumMaterials Science Forum Vols. 475-479Directional Solidification of Undercooled...

Directional Solidification of Undercooled Hypoeutectic Silver-Copper Alloy Melt

Abstract:

Directional solidification of the undercooled melt which combines melt undercooling with conventional directional solidification is a new method of obtaining directional structure. This method is used to realize the directional solidification of the undercooled Ag70.3Cu29.7 melt. The experiment is performed in two steps: The undercooled melt is obtained by glass fluxing, and the above specimen is remelted and excited with Ga-In-Sn coolant. By this method, directional solidification dendrites of Ag70.3Cu29.7 alloy are achieved successfully. The columnar dendrites are straight and fine. The primary arm spacing is 21µm in average for a 65K undercooling, as compared to 38µm for a 32K undercooling. This confirms that higher undercooling promotes finer dendritic microstructures.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

2607-2610

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.2607

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Online since:

January 2005

Authors:

Yu Ying Lu, Hong Xing Zheng, Fa Qin Xie, Jian Guo Li

Keywords:

Ag-Cu Alloy, Directional Solidification, Solidified Characteristic, Undercooling

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