Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It’s Effects on the Shear Force of the Solder Bumps

Se Hoon Park; Young Ho  Kim

doi:10.4028/www.scientific.net/MSF.475-479.1881

Paper Titles

The Texture and Property of Diffusion Barrier of TiN Thin Films
p.1865

Application of TLP (Transient Liquid Phase) Bonding Method to the High T_m Lead-Free Solder
p.1869

Changes of Fatigue Property with Heat Exposure in INVAR/AW Wire
p.1873

Properties of Electroless Nickel Composite Plating Film
p.1877

Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It’s Effects on the Shear Force of the Solder Bumps
p.1881

Simulation and Fabrication of Silicon Micro-Grippers Actuated by Piezoelectric Actuator
p.1885

Carbon Nanotube Field Emitters for Display Applications Using Screen Printing
p.1889

Effect of Pressure on Melting Temperature of Silicon and Germanium
p.1893

Polarized Photoluminescence and Temperature-Dependent Photoluminescence Study of InAs Quantum Wires on InP (001)
p.1897

HomeMaterials Science ForumMaterials Science Forum Vols. 475-479Intermetallic Formation between Sn-Ag(-Cu) Solder...

Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It’s Effects on the Shear Force of the Solder Bumps

Abstract:

The shear force of Sn-3.5Ag and Sn-3.8Ag-0.7Cu solder bumps formed by the stencil printing method was measured and the effects of intermetallic formation on the shear force of solder bumps were investigated. The Sn-Ag(-Cu) solder paste was printed on the Au/Ni/Ti under bump metallurgy (UBM) and then reflowed repeatedly. The shear force of the solder bumps was measured as a function of the reflow times. The intermetallic formation in the Sn-Ag(-Cu) solder/UBM was characterized using scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS) and x-ray diffractormeter. Ni3Sn4 phase was formed in the Sn-3.5Ag solder/UBM interface and (Cu,Ni)6Sn5 phase formed at the Sn-3.8Sg-0.7Cu solder/UBM interface. The shear force of solder bumps was sensitive to the depletion of Ni layer and the intermetallic thickness at the solder/Ni interface. The shear forces of Sn-3.5Ag solder bumps decreased rapidly after the fifth reflow due to the depletion of Ni layer in the UBM. The shear forces of Sn-3.8Ag-0.7Cu solder bumps decreased after the tenth reflow due to extensive growth of intermetallic layer in the solder/Ni interface.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

1881-1884

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.1881

Citation:

Cite this paper

Online since:

January 2005

Authors:

Se Hoon Park, Young Ho Kim

Keywords:

Intermetallic Compound (IMC), Shear Force, Sn-3.5Ag Solder, Sn-3.8Ag-0.7Cu Solder

Export:

RIS, BibTeX

Price:

Permissions:

Request Permissions

References

[1] J.H. Lau: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies (McGraw-Hill, New York 2000), pp.50-55.

Google Scholar

[2] Y.D. Jeon, A. Ostmann, H. Reichl, and K.W. Paik: 53rd Electronic Components and Technology Conference (2003), pp.1203-1208.

Google Scholar

[3] J.H. Lau: Chip on Board Technologies for Multichip Module (Kluwer Academic Publishers, Dordrecht 1994), pp.243-246.

Google Scholar

[4] F. Zhang, M. Li, and C.C. Chum: J. Materials Research Society. Vol. 17 (2002), pp.2757-2760.

Google Scholar

[5] S.T. Yang, Y. Chung, and Y.H. Kim: J. Microelectronics & Packaging Society. Vol. 9 (2002), pp.1-9.

Google Scholar

[6] K. Suganuma: Current Opinion in Solid State & Materials Science. Vol. 5 (2001), pp.55-64.

Google Scholar