Gr/Cu Composites: Microstructure and Properties

Yu Zhang; Yan Li; Jin Hua Cao; Yan Chun Li; Mei Hui Song; Xiao Chen Zhang

doi:10.4028/www.scientific.net/MSF.1035.851

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HomeMaterials Science ForumMaterials Science Forum Vol. 1035Gr/Cu Composites: Microstructure and Properties

Gr/Cu Composites: Microstructure and Properties

Abstract:

Graphene(Gr) reinforced copper matrix composites(Gr/Cu) were prepared by powder metallurgy process, and the effects of graphene content on microstructure and properties of the composites were investigated. The microstructure, density, hardness and electrical conductivity of the composites were analyzed by scanning electron microscopy (SEM), transmission electron microscopy (TEM), density measurement, hardness tester and conductivity meter. The results show that the interface bonding of the composite is good, there is no crack and no obvious interface reaction; there are a lot of dislocations and twins in Cu matrix. With the increase of graphene content, the density, heat capacity and thermal conductivity of the composites decrease, but the hardness increases first and then decreases.

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Periodical:

Materials Science Forum (Volume 1035)

Pages:

851-855

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.1035.851

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Online since:

June 2021

Authors:

Yu Zhang, Yan Li, Jin Hua Cao, Yan Chun Li, Mei Hui Song*, Xiao Chen Zhang

Keywords:

Copper, Graphene, Microstructure, Preparation, Properties

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* - Corresponding Author

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