Study of SiC’s Mechanical Property Variance Caused by Film Thickness

Zong Lei Jiao; Jian Zhu

doi:10.4028/www.scientific.net/KEM.645-646.400

Paper Titles

UV Photocatalytic Digestion Utilizing TiO₂ Nano-Fiber for the Determination of Total Phosphorus
p.375

Research of Thin Film for Laser Polarization Beam Splitter
p.381

Micro Laser Joining between Dissimilar Materials of 200μm Thick TiNi Alloy and Stainless Steel and the Joint’s Electrochemical Behavior
p.388

Electrokinetic Research on the Dispersion Behavior of Nano-Ceria Particles in Concentrated Suspensions
p.394

Study of SiC’s Mechanical Property Variance Caused by Film Thickness
p.400

Experimental Study on the Relationship between Dislocation Density and Internal Stress in Micro Electroforming Layer
p.405

Influence of Hybrid Fibers on Flexural Properties of Ultra High Toughness Cementitous Composites with Nano-SiO₂
p.411

The Influence of Polyhedral Oligomeric Silsesquioxane on Heat Resistance and Curing Kinetics of Potting Materials
p.416

Study on Mechanism of Phase Forming in Ni⁺ Implantation into Ti6Al4V at Elevated Temperature
p.421

HomeKey Engineering MaterialsKey Engineering Materials Vols. 645-646Study of SiC’s Mechanical Property Variance Caused...

Study of SiC’s Mechanical Property Variance Caused by Film Thickness

Abstract:

The mechanical properties of SiC thin films deposited by chemical vapor deposition process on silicon substrate are studied using nanoindentation techniques. The SiC thin films are of three different thicknesses: 1.6μm、4.5μm、9μm. In this study, nanoindentation method is preferred due to its reliability and accuracy on determining mechanical properties from indentation load-displacement data. The mechanical properties of elastic modulus and hardness are characterized. 1.6μm SiC thin film has the following values: E=345.73Gpa, H=33.71Gpa; 4.5μm SiC thin film has the following values: E=170.18Gpa, H=10.33Gpa; 9μm SiC thin film: E=167.96Gpa, H=9.48Gpa

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 645-646)

Pages:

400-404

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.645-646.400

Citation:

Cite this paper

Online since:

May 2015

Authors:

Zong Lei Jiao*, Jian Zhu

Keywords:

Mechanical Property, Nanoindentation, Silicon Carbide (SiC), Thin Film

Export:

RIS, BibTeX

Price:

Permissions:

Request Permissions

* - Corresponding Author

References

[1] W. J. Choyke and G. Pensl, Physical Properties of SiC, MRS Bull, 1997, 22.

Google Scholar

[3] 25-9.

Google Scholar

[2] A.R. Atell, R.S. Okojie, K.T. Kornegay, S.L. Roberson, Simulation, fabrication and testing of bulk micromachined 6H-SiC high-g piezoresistive accelerometers, Sens. Actuator A, Phys, 2003, 1. 4, 1, 11-18.

DOI: 10.1016/s0924-4247(02)00436-3

Google Scholar

[3] Nagasawa, H and Yamaguchi, Y, Thin Solid Films,J. 1993, 225, 191-234.

Google Scholar

[4] Li X D, B Hu Shan, A review of nanoindentation continues stiffness measurement technique and its application[J], Materials Characterization, 2002, 48(1): 11-36.

Google Scholar

[5] G.M. Pharr and W.C. Oliver, Measurement of Thin-Film Mechanical Properties Using Nanoindentation, MRS Bull, 1992, 17.

DOI: 10.1557/s0883769400041634

Google Scholar

[7] 28-33.

Google Scholar

[6] W.C. Oliver and G.M. Pharr, An Improved Technique for Determining Hardness and Elastic Modulus Using load and Displacement Sensing Indentation Experiments, Mater. Res, J. 1993, 7.

DOI: 10.1557/jmr.1992.1564

Google Scholar

[6] 1564-83.

Google Scholar

[7] J.H. Kim, H.K. Lee, J.Y. Park, Mechanical Properties of Chemical-Vapor-Deposited Silicon Carbide using a Nanoindentation Technique, Journal of the Korean Ceramic Society, 2008, 45, 9, 218-523.

DOI: 10.4191/kcers.2008.45.9.518

Google Scholar