Study on Preparation and Properties of a Room Temperature Fast Curing Epoxy Resin Nano-Adhesive

Abstract:

A room temperature fast curing epoxy resin nano-adhesive was prepared and modified by nano-SiO2 and liquid rubber CTBN. It shows good shear strength value and heat-durability and also meets the conditions of room temperature and short solidified time. Compared with conventional resin mixing method, adhesive modified by nanomaterial can achieve better heat-durability. Compound cation/nonionic surfactants were used for modifying nano-SiO2 and solution mix method was used for preparation of nano-SiO2 epoxy resin adhesive. The effects of nano-SiO2 to adhesive’s mechanical property and heat-durability were investigated. Adhesive with 2wt% nano-SiO2 shows improved properties which shear strength value is 17.9 MPa and vitrification point is 216.5°C. Micropores and grains of nano-SiO2/liquid rubber CTBN modifying system were observed using scanning electron microscope. Adhesives were investigated using infrared spectroscopy analysis. Nano-SiO2 modified using compound surfactant has higher reacting activity and accelerates the reaction of adhesive. It can be used as catalyst.