Thermal Model's Building and Experimental Research in Grinding Contact Zone for Plunge Grinding Process
p.281
p.281
Molecular Dynamics Analyze on Effects of Abrasive Size and Cut Depth on the Monocrystal Silicon Grinding
p.286
p.286
The Formation and Control of Surface Cracks in the Cemented Carbide Materials in the Process of Grinding
p.290
p.290
Analysis of Dynamic Characteristics in Polishing Based on Two-Dimension Vibration of Fluid
p.295
p.295
Simulation Study on the Developed Eccentric V-Grooves Lapping Mode for Precise Ball
p.300
p.300
Study on the Dependence of Glossiness on the Micro-Uneven of Natural Granite Surface
p.305
p.305
Study on Chemical Mechanical Polishing Mechanism of LiTaO3 Wafer
p.310
p.310
Wear Mechanism of Diamond Saw Blades for Dry Cutting Concrete
p.315
p.315
Magnetic Field-Assisted Polishing for Ferromagnetic Metallic Material
p.320
p.320
Simulation Study on the Developed Eccentric V-Grooves Lapping Mode for Precise Ball
Abstract:
A novel lapping mode is developed on the base of present eccentric v-grooves lapping mode for precise balls. The kinematics analysis shows that the ball spin axis can wiggle up to 180° under the developed mode, so the lapping trace will be dispersed onto the whole surface of the ball. The effect of offsetting and groove radius on the lapping uniformity in the developed eccentric v-grooves, the present eccentric v-grooves and the traditional v-grooves lapping mode are compared, and the advantage of the developed mode is that the impact offsetting is less while the groove radius has no impact.
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Periodical:
Key Engineering Materials (Volumes 304-305)
Pages:
300-304
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Online since:
February 2006
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