New Laser Cutting Technology of Sapphire Wafers on Crystals

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Abstract:

The work is devoted to development of new cutting technology of semiconductor wafers on crystals by a method of laser controlled thermocracking. There are results of numerical and experimental researches of the cut sapphire wafers on crystals for light-emitting diodes by means of two lasers (СО2 laser and UV laser).

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30-34

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February 2013

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