极端热冲击和电流密度耦合Sn-3.0Ag-0.5Cu焊点组织演变

doi:10.3901/JME.2022.02.291

机械工程学报 ›› 2022, Vol. 58 ›› Issue (2): 291-299.doi: 10.3901/JME.2022.02.291

• 微纳连接界面与可靠性 • 上一篇下一篇

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极端热冲击和电流密度耦合Sn-3.0Ag-0.5Cu焊点组织演变

李胜利¹, 任春雄¹, 杭春进¹, 田艳红¹, 王晨曦¹, 崔宁², 蒋倩³

1. 哈尔滨工业大学先进焊接与连接国家重点实验室哈尔滨 150001;
2. 中国长城工业集团有限公司北京 100089;
3. 北京航天长城卫星导航科技有限公司北京 100089

收稿日期:2021-04-26 修回日期:2021-07-05 出版日期:2022-01-20 发布日期:2022-03-19
通讯作者: 杭春进(通信作者),男,1978年出生,博士,副教授,博士研究生导师。主要研究方向为微连接与电子封装。E-mail:hangcj@hit.edu.cn
作者简介:李胜利,男,1992年出生,博士研究生。主要研究方向为微连接与电子封装。E-mail:lshengli1025@163.com
基金资助:
国家自然科学基金（51775141）和黑龙江“头雁”团队资助项目。

Microstructure Evolution of Sn-3.0Ag-0.5Cu Solder Joints under Extreme Temperature Changes and Current Stressing

LI Shengli¹, REN Chunxiong¹, HANG Chunjin¹, TIAN Yanhong¹, WANG Chenxi¹, CUI Ning², JIANG Qian³

1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001;
2. China Great Wall Industry Corporation, Beijing 100089;
3. China Great Wall Industry Corporation Navigation Co., Ltd., Beijing 100089

Received:2021-04-26 Revised:2021-07-05 Online:2022-01-20 Published:2022-03-19

摘要/Abstract

摘要： 深空探测环境中电子设备焊点面临极端温度和电场耦合的严峻考验。在-196~150℃极端温度热冲击和1.5×10⁴A/cm²电流密度的耦合载荷下，对Sn-3.0Ag-0.5Cu焊点的微观组织演变规律和电流拥挤效应进行分析，描述焊点微观组织演变及电阻变化之间的联系。试验结果表明，热冲击前期，阳极处IMC厚度呈抛物线规律增加，其成分为Cu₆Sn₅；阴极处IMC厚度减小且成分也为Cu₆Sn₅。随着热冲击次数的增加，电子风力和应力梯度的方向一致的焊点阳极处IMC厚度持续增厚，阴极处界面IMC不断消融；当二者方向相反时，焊点阳极处界面IMC厚度开始减薄，阴极处界面IMC厚度明显增加，焊点电阻有所增加，且在焊点的电流输入端还出现了电流集中效应。此外，双层IMC之间贯穿焊点的疲劳裂纹导致了焊点失效，焊点的电阻值达到无穷大。

关键词: Sn-3.0Ag-0.5Cu焊点, 极端温度, 热冲击, 电流, 金属间化合物

Abstract: During deep space exploration, electronic assemblies without thermal protection have to be subjected to extreme temperature environments and electric field coupling. In this work, the coupled load of extreme temperature thermal shock test -196-150℃ and 1.5×10⁴ A/cm² current density was conducted to investigate the microstructure evolution and current crowding of the solder joints, as well as the relationship between the microstructure evolution and the resistance change. The results show that the anodic intermetallic compound (IMC) increased parabolically and the composition of IMC was Cu₆Sn₅. Meanwhile, the thickness of cathodic IMC increased, and its composition was Cu₆Sn₅ at the pre-thermal shock stage. When the direction of electron wind and stress gradient of solder joints were identical, the anodic interfacial IMC was found to increase and the cathodic interfacial IMC was about to be fused as the thermal shock increased. However, when the direction was reversed, the thickness of the anodic IMC reduced obviously, the thickness of the interface IMC of the anodic and cathode reduced obviously and thicken respectively. The resistance of the solder joint increased and the phenomenon of current concentration was observed at the current input. In addition, a straight crack was formed at the IMC layer, which led to the failure of the solder joint and the resistance value of the solder joint reached infinity.

Key words: Sn-3.0Ag-0.5Cu solder joints, extreme temperature, thermal shock, current stress, intermetallic compounds

中图分类号:

TG407

李胜利, 任春雄, 杭春进, 田艳红, 王晨曦, 崔宁, 蒋倩. 极端热冲击和电流密度耦合Sn-3.0Ag-0.5Cu焊点组织演变[J]. 机械工程学报, 2022, 58(2): 291-299.

LI Shengli, REN Chunxiong, HANG Chunjin, TIAN Yanhong, WANG Chenxi, CUI Ning, JIANG Qian. Microstructure Evolution of Sn-3.0Ag-0.5Cu Solder Joints under Extreme Temperature Changes and Current Stressing[J]. Journal of Mechanical Engineering, 2022, 58(2): 291-299.

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极端热冲击和电流密度耦合Sn-3.0Ag-0.5Cu焊点组织演变

Microstructure Evolution of Sn-3.0Ag-0.5Cu Solder Joints under Extreme Temperature Changes and Current Stressing

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