材料システム
Online ISSN : 2435-9734
Print ISSN : 0286-6013
導電性高分子を用いた熱硬化型CFRPの開発と評価
横関 智弘後藤 晃哉高橋 辰宏銭 丹娜伊藤 昌次平野 義鎭石田 雄一小笠原 俊夫石橋 勝
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2016 年 34 巻 p. 35-38

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In this work, we describe the development of carbon fiber reinforced plastics (CFRP) using a polyaniline (PANI) -based electrically conductive thermoset matrix to enhance its electrical properties. The conductive thermosetting resin uses dodecylbenzenesulfonic acid (DBSA) and p-toluenesulfonic acid (PTSA) as dopants and divinylvenzene (DVB) as the crosslinking polymer. The thermal and electrical properties of the PANI-based thermosetting resin are characterized as part of the work. The developed resin is utilized to fabricate CFRP by a prepreg-based hot press method. This paper reports on the electrical properties of the fabricated CFRPs, which exhibit excellent electrical conductivity in the thickness direction. Finally, the electromagnetic shielding properties of the developed CFRP are demonstrated and compared to traditional CFRP.

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© 2016 金沢工業大学 材料システム研究所
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