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Correction

Correction: Panjan et al. Surface Topography of PVD Hard Coatings. Coatings 2021, 11, 1387

1
Jožef Stefan Institute, Jamova 39, 1000 Ljubljana, Slovenia
2
Jožef Stefan International Postgraduate School, Jamova 39, 1000 Ljubljana, Slovenia
*
Author to whom correspondence should be addressed.
Coatings 2023, 13(2), 435; https://doi.org/10.3390/coatings13020435
Submission received: 8 December 2022 / Accepted: 13 February 2023 / Published: 15 February 2023
(This article belongs to the Special Issue Surface Topography Effects on Functional Properties of PVD Coatings)

Error in Table

The authors wish to make the following correction to this paper [1]:
In the row “average deposition rate” of Table 1 (page 5) the unit “nm/s” must be replaced with the unit “nm/min”. The corrected Table 1 appears below. The authors state that the scientific conclusions are unaffected. This correction was approved by the Academic Editor. The original publication has also been updated.

Reference

  1. Panjan, P.; Drnovšek, A.; Mahne, N.; Čekada, M.; Panjan, M. Surface Topography of PVD Hard Coatings. Coatings 2021, 11, 1387. [Google Scholar] [CrossRef]
Table 1. Deposition methods and process parameters used for the preparation of PVD hard coatings. The deposition rates and ion current density are averages since all deposition techniques exhibited both spatial and temporal variations during a given deposition run as well as from one run to another run (depending on batching material).
Table 1. Deposition methods and process parameters used for the preparation of PVD hard coatings. The deposition rates and ion current density are averages since all deposition techniques exhibited both spatial and temporal variations during a given deposition run as well as from one run to another run (depending on batching material).
Deposition SystemBAI 730CC800/7CC800/9 sinOx MLAIPocket
PreheatingHeating methodElectron bombardmentInfrared heatingInfrared heatingInfrared heating
Preheating temperature (°C)450450450450
EtchingEtching modeDCRFMF/boosterpulsed DC
Type of ionsArAr + KrAr + KrAr
Negative substrate etching voltage (V)200200650/200300/400
Etching time (min)1585 + 55 **15/6045
DepositionDeposition methodLow-voltage electron beam evaporationMagnetron sputteringMagnetron sputteringCathodic arc evaporation
Temperature (°C)450450450450
Working gasAr + N2Ar + Kr + N2Ar + Kr + N2N2
Pressure of working gas (Pa)0.20.750.664
Deposition time (min)8016520045
Negative substrate bias voltage (V)125959070
Average deposition rate * (nm/min)50202085
Average substrate current density (mA/cm2)3–5~2~2.5-
* For twofold rotation of substrates, ** intermediate etching.
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MDPI and ACS Style

Panjan, P.; Drnovšek, A.; Mahne, N.; Čekada, M.; Panjan, M. Correction: Panjan et al. Surface Topography of PVD Hard Coatings. Coatings 2021, 11, 1387. Coatings 2023, 13, 435. https://doi.org/10.3390/coatings13020435

AMA Style

Panjan P, Drnovšek A, Mahne N, Čekada M, Panjan M. Correction: Panjan et al. Surface Topography of PVD Hard Coatings. Coatings 2021, 11, 1387. Coatings. 2023; 13(2):435. https://doi.org/10.3390/coatings13020435

Chicago/Turabian Style

Panjan, Peter, Aljaž Drnovšek, Nastja Mahne, Miha Čekada, and Matjaž Panjan. 2023. "Correction: Panjan et al. Surface Topography of PVD Hard Coatings. Coatings 2021, 11, 1387" Coatings 13, no. 2: 435. https://doi.org/10.3390/coatings13020435

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