Low Stress, High Modulus, Photosensitive Polyimide

Hiroko Takahashi; Etsuharu Suzuki; Keiko Suzuki; Masayuki Ohe

doi:10.2494/photopolymer.28.215

Hiroko Takahashi, Etsuharu Suzuki, Keiko Suzuki, Masayuki Ohe

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Keywords: polyimide, low stress, high modulus, cross-linkable compounds, chemical resistance

JOURNAL FREE ACCESS

2015 Volume 28 Issue 2 Pages 215-218

DOI https://doi.org/10.2494/photopolymer.28.215

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Abstract

We developed a solvent developable, negative-tone, low stress, high modulus PI that can be cured below 300°C. The chemical resistance of the initial setting material in Dynastrip 7700 and NMP was not good but subsequently improved by selecting a suitable cross-linkable monomer without significantly sacrificing original thermal and mechanical properties.

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