Journal of Photopolymer Science and Technology
Online ISSN : 1349-6336
Print ISSN : 0914-9244
ISSN-L : 0914-9244
Development of Liquid Solder Resist Based on Polyimide
Nobuo Matsumura, Akira Shimada, Keiko Yamanaka
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Keywords: polyimides, flexible printed circuit board(FPC), coverlay
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2009 Volume 22 Issue 4 Pages 437-439

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© 2009 The Society of Photopolymer Science and Technology (SPST)
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