A new measuring system (Holographic Pattern Measuring System, HPMS) has been developed to the thermal deformation analysis of printed circuit board (PCB) due to thermal stress. The HPMS combines both techniques of holography and graphic image processing. The tempaeature on the PCB surface was measured by using a thermographic video system, and the relationship between temperature and displacement of the PCB was studied. As a result, the microscopical displacement of the displacement can be quantitatively measured, and the distribution of the displacement can be displayed as a three dimensional graphic image. The temperature distribution of the PCB surface showed the various relationship between the characteristics of the deformation. Therefore, the holographic pattern testing method may be useful in analysis of the detail thermal stress evaluation of the PCB.