Investigation of interfacial reactions between Sn–Ag–Bi–In solder and (Cu, electroless Ni–P/Cu) substrate

Jeong-Won Yoon; Chang-Yong Lee; Chang-Bae Lee; Choong-Sik Yoo; Seung-Boo Jung

doi:10.1515/ijmr-2003-0078

Published by De Gruyter February 3, 2022

Investigation of interfacial reactions between Sn–Ag–Bi–In solder and (Cu, electroless Ni–P/Cu) substrate

Jeong-Won Yoon , Chang-Yong Lee , Chang-Bae Lee , Choong-Sik Yoo and Seung-Boo Jung

From the journal International Journal of Materials Research

https://doi.org/10.1515/ijmr-2003-0078

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Abstract

The growth kinetics of intermetallic compound layers formed between Sn–3Ag–8Bi – 5In solder and (Cu, electroless Ni – P/Cu) substrate were investigated at temperatures between 70 and 170 °C for 1 to 60 days. The layer growth of the intermetallic compounds in the Sn–Ag– Bi – In/Cu and Sn–Ag –Bi – In/electroless Ni –P systems satisfied the parabolic time law. As a whole, because the values of time exponent have approximately 0.5, the layer growth is mainly controlled by diffusion. The apparent activation energies for the growth of the Cu₆Sn₅ and Ni₃Sn₄ intermetallic compounds are 81.4 and 67.1 kJ/mol, respectively.

Keywords: Sn –Ag–Bi – In solder; Interfacial reaction; Electroless Ni plating; Growth kinetics; Intermetallic compounds; Activation energy; Soldering

Prof. Seung-Boo Jung Department of Advanced Materials Engineering SungKyunKwan University 300 Chunchun-dong, Jangan-gu, Suwon 440-746, Korea Tel.: +82 31 290 7359 Fax: +82 31 290 7371

This work was supported by the Advanced Materials and Process Research Center for IT at Sungkyunkwan University, Korea (Grant No. R12-2002-057-03001-0).

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Received: 2002-11-21

Published Online: 2022-02-03

Investigation of interfacial reactions between Sn–Ag–Bi–In solder and (Cu, electroless Ni–P/Cu) substrate

Abstract

References

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