Ice adhesion to a cooling solid surface often occurs in many situations. And it causes many serious problems accompanying economic losses. Therefore, it is necessary to clarify the mechanism of ice adhesion to the cooling surface. In the past studies, ice adhesion force was affected by behavior of removal of ice from the surface of the cooling plate. Moreover, the force is also affected by surface modification such as plasma and ultraviolet rays irradiation to the plate surface and removal of the oxide layer from the plate surface. Thus, in this paper, considering shear stress corresponding to adhesion force, the relationship between behavior of removal of ice from the copper plate surface and surface modification is investigated with variation in the surface temperatures.