Micro-sensor which embedded in die was fabricated by using semiconductor processing technology. Follow a previous report, we applied the sensing system to V-bending process and we performed a trial to estimate bending angle with this system. In this paper, we optimized the shape of the die and the shape of the sensor tip and the placement to get the strain correct information from the die shoulder during processing. And by converting the strain information from a sensor into the strain ratio, we showed possibility to be able to treat as the information that was hard to be influenced by a change of the load.