年次大会講演論文集
Online ISSN : 2433-1325
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722 スペックル法による混合モードき裂の応力解析
町田 賢司碓井 健司平野 剛頼
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p. 201-202

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The displacement around the crack tip of homogeneous and dissimilar materials was measured by speckle photography. A CNS specimen was employed to measure the displacement under the various mixed-mode loading. The displacement data obtained by speckle photography were not as smooth as that obtained by the finite element analysis. A large error arose in the evaluation of stress-intensity factors from the raw displacement data. Therefore, the displacement data were smoothed by 2-D fast Fourier transform and the least squares method. Then, stress-intensity factors of asymptotic solution derived by Sun and Jih were evaluated using the displacement data obtained from speckle photography by the least squares method. The stress-strain field near the crack tip evaluated by using the asymptotic solution was in good agreement with that of finite element analysis.

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