The liquid crystal polymer substrates with low dielectric constant have attracted much attention as one of printed circuit board materials. However, it is chemically stable and difficult to form Cu wire on the substrates. We focused on the laser sintering of Cu microparticles for wire manufacturing, the process is a simpler than conventional electroplating. In this study, The Nd:YVO₄ laser with wavelength of 532 nm and a Gaussian-shaped beam was utilized for sintering, and the beam profile and the spot diameter in the x-direction can be controlled by changing the defocus amount of the laser fabrication setup. Since the low-intensity region of the beam profile does not work, the moderated spot diameter effects on line thinning and densification of the laser-sintered Cu films. When the laser beam with spot diameter of 240 μm irradiated to the coating film, the laser-sintered Cu film with width of 212 μm and specific resistance of 20.5 μΩ·cm was formed. In the cross-sectional observation of the laser-sintered films, the bulky copper with metallic luster was observed at the center of the films.