関西支部講演会講演論文集
Online ISSN : 2424-2756
セッションID: 620
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620 電子スペックルパターン干渉法を用いた低温領域における板材の熱膨張率の測定(OS-4 ダイナミクス計測と診断,研究発表講演)
村瀬 健中原 住雄藤田 武良久田 重善
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The thermal expansion coefficient of rectangular specimens at low temperatures was measured by Electronic Speckle Pattern Interferometry(ESPI). Since ESPI is a non-contact measurement method, ESPI system doesn't receive the influence of temperature change. The thermal expansion coefficient was obtained from the thermal strain acquired by ESPI and the temperature measurement for specimens of Poly tetra fluoro ethylene(PTFE) and Stainless steel(SUS316). The thermal expansion coefficients of SUS316 and PTFE were obtained in the temperature range from 130K to 300K, 150K to 330, respectively. These data agree well with the published ones.

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© 2005 一般社団法人 日本機械学会
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