Jonathan Ting
Sang Ho Yoon
ABSTRACT
In recent years, in-mold electronics (IME) technique was introduced as a combination of printing electrically functional materials and vacuum plastic forming. IME has gained significant attention across various industries since it enables various electrical functionalities on a wide range of 3D geometries. Although IME shows great application potentials, hardships still exist during design for the manufacturing stage. For example, printed 2D structures experience mechanical bending and stretching during vacuum forming. This results in challenges for designers to ensure precise circuit-to-3D mold registration or to prevent over deformation of circuit and attached components. To this end, we propose a software toolkit that provides real time 2D-to-3D mapping, guided structural and electrical circuit design with interactive user interface. We present a novel software-guided IME process that leads to fully functional 3D electronic structures with printed conductive traces and assembled surface-mount components.
- Sun Chemical. 2019. In-Mold Electronic Materials. Retrieved Nov 30, 2019. (Nov. 2019). from https://www.sunchemical.com/product/in-mold-electronic-materials-ime.Google Scholar
- DuPont. 2019. DuPont In-Mold Electronic Technology. Retrieved Nov 30, 2019. (Nov. 2019). from https://www.dupont.com/products/in-mold-electronic-technology.html.Google Scholar
- DuraTech. 2019. IN-MOLD ELECTRONICS (IME). Retrieved Nov 30, 2019. (Nov. 2019). from https://www.duratech.com/capabilities/ime-in-mold-electronics.Google Scholar
- Eastprint. 2019. IN-MOLD ELECTRONICS DESIGN & MANUFACTURING AT EASTPRINT, INC. Retrieved Nov 30, 2019. (Nov. 2019). from https://www.eastprint.com/in-mold-electronics.html.Google Scholar
- ECM. 2019. Product List. Retrieved Nov 30, 2019. (Nov. 2019). from http://www.conductives.com/new_products.php.Google Scholar
- Ghaffarzadeh, Khasha and Collins, Richard . 2019. In-Mold Electronics 2019--2029: Technology, Market Forecasts, Players. Technical Report.Google Scholar
- Pentti Karioja, Jukka-Tapani Mäkinen, Kimmo Keränen, Janne Aikio, Teemu Alajoki, Tuomo Jaakola, Matti Koponen, Antti Keränen, Mikko Heikkinen, Markus Tuomikoski, and others. 2012. Printed hybrid systems. In Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012, Vol. 8344. International Society for Optics and Photonics, 83440G.Google ScholarCross Ref
- Terho Kololuoma, Mikko Keränen, Timo Kurkela, Tuomas Happonen, Marko Korkalainen, Minna Kehusmaa, Lucia Gomez, Aida Branco, Sami Ihme, Carlos Pinheiro, and others. 2019. Adopting Hybrid Integrated Flexible Electronics in Products: Case-Personal Activity Meter. IEEE Journal of the Electron Devices Society (2019).Google Scholar
- Ligang Liu, Lei Zhang, Yin Xu, Craig Gotsman, and Steven J Gortler. 2008. A local/global approach to mesh parameterization. In Computer Graphics Forum, Vol. 27. Wiley Online Library, 1495--1504.Google ScholarDigital Library
- JT Mäkinen, K Keränen, T Alajoki, M Koponen, A Keränen, A Kemppainen, and K Rönkä. 2011. Over-molded electronics and printed hybrid systems. In SMTA Microelectronic Symposium, Kona. 18--20.Google Scholar
- Creative Materials. 2019. Conductive Silver Inks. Retrieved Nov 30, 2019. (Nov. 2019). from http://www.creativematerials.com/products/silver-inks.Google Scholar
- TactoTek Oy. 2019. TactoTek. Retrieved Nov 30, 2019. (Nov. 2019). from https://tactotek.com.Google Scholar
- Christian Schüller, Daniele Panozzo, Anselm Grundhöfer, Henning Zimmer, Evgeni Sorkine, and Olga Sorkine-Hornung. 2016. Computational thermoforming. ACM Transactions on Graphics (TOG) 35, 4 (2016), 43.Google ScholarDigital Library
- Charlie CL Wang. 2004. CyberTape: An interactive measurement tool on polyhedral surface. Computers & Graphics 28, 5 (2004), 731--745.Google ScholarCross Ref
- Yunbo Zhang and Tsz Ho Kwok. 2017. An interactive product customization framework for freeform shapes. Rapid Prototyping Journal 23, 6 (2017), 1136--1145.Google ScholarCross Ref
- Yizhong Zhang, Yiying Tong, and Kun Zhou. 2016. Coloring 3D printed surfaces by thermoforming. IEEE transactions on visualization and computer graphics 23, 8 (2016), 1924--1935.Google Scholar
Index Terms
- iMold: Enabling Interactive Design Optimization for In-Mold Electronics
Recommendations
Roll-to-roll UV imprint lithography for flexible electronics
We propose a roll-to-roll UV imprint lithography tool as a way to pattern flexible PET foil with @mm-resolution. As a way to overcome dimensional instability of the foil and its effect on overlay, a self-align approach was investigated, that permits to ...
Integrated DLP and DIW 3D Printer for Flexible Electronics
Intelligent Robotics and ApplicationsAbstract3D printing is an efficient way to fabricate flexible electronics due to its ability to fabricate complex soft structures. However, the development of 3D printing flexible electronics is hindered by the development of multi-material 3D printing ...
A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications
AbstractMetallization of a polydimethylsiloxane (PDMS)-based substrate is a challenge due to the difficulties in forming crack-free polymer and metal features using standard deposition techniques. Frequently, additional adhesion layers, rigid ...
Graphical abstractDisplay Omitted
Highlights- Crack-free deposition of electroless copper over elastomeric surfaces.
- Strong ...
Comments