Pedro Chaparro
ABSTRACT
Multi-core architectures require Dynamic Thermal Management mechanisms (DTM) to handle (1) multiple hotspots and (2) global chip heating effect while finding the best trade-off between performance and thermal control. In that scenario Thin-Film Thermoelectric Cooling devices can be used to mitigate both effects since they provide on-die localized cooling with a dynamic and heterogeneous effect. This work proposes controlling TFTECs from the microarchitecture for an enhanced Dynamic Thermal Management in multi-core architectures. We show that by using our TFTEC-based proposals the performance is within 8% of that of a thermally-unconstrained processor.
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Index Terms
- Dynamic thermal management using thin-film thermoelectric cooling
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