A novel approach to predict the pin load distribution of multiple bolt-jointed composite laminate based on the circuit model

Xiankun Yang; Haoyuan Chen; Linan Cheng; Xitao Zheng

doi:10.1117/12.923222

12 April 2012 A novel approach to predict the pin load distribution of multiple bolt-jointed composite laminate based on the circuit model

Xiankun Yang, Haoyuan Chen, Linan Cheng, Xitao Zheng

Author Affiliations +

Proceedings Volume 8409, Third International Conference on Smart Materials and Nanotechnology in Engineering; 84092A (2012) https://doi.org/10.1117/12.923222
Event: Third International Conference on Smart Materials and Nanotechnology in Engineering, 2011, Shenzhen, China

Abstract

The circuit model was applied to predict the pin load distribution of composite multiple bolt-joint structure. The load, flexibility and deformation of the mechanics model were equivalent to the current, resistance and voltage of the circuit model, respectively. Based on the above assumption, it could be found that the Hooke's law and the deformation compatibility equation in the origin mechanics model transformed into the Ohm's law and the voltage balance equation in the new circuit model. This approach translated the complex model of composite multiple bolt-jointed into a simple circuit model which consisted of some series circuits and parallel circuits. The analysis of the new circuit model had formed n-1 independence voltage balance equations and a current balance equation, thus, the current and load of each bolt could be calculated. In the new model, power sources which were added as required in some branch circuits could also simulate the clearance or interference in the origin model. Compared with the result of the multiple bolt-joints composite laminate test, the new approach could make an excellent performance to estimate the load distribution.

Citation Download Citation

Xiankun Yang, Haoyuan Chen, Linan Cheng, and Xitao Zheng "A novel approach to predict the pin load distribution of multiple bolt-jointed composite laminate based on the circuit model", Proc. SPIE 8409, Third International Conference on Smart Materials and Nanotechnology in Engineering, 84092A (12 April 2012); https://doi.org/10.1117/12.923222

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