High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

Jingwei Wang; Lijun Kang; Pu Zhang; Zhiqiang Nie; Xiaoning Li; Lingling Xiong; Xingsheng Liu

doi:10.1117/12.909655

8 February 2012 High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

Jingwei Wang, Lijun Kang, Pu Zhang, Zhiqiang Nie, Xiaoning Li, Lingling Xiong, Xingsheng Liu

Author Affiliations +

Proceedings Volume 8241, High-Power Diode Laser Technology and Applications X; 82410H (2012) https://doi.org/10.1117/12.909655
Event: SPIE LASE, 2012, San Francisco, California, United States

Abstract

High power semiconductor laser arrays have found increased applications in many fields. In this work, a hard soldering microchannel cooler (HSMCC) technology was developed for packaging high power diode laser array. Numerical simulations of the thermal behavior characteristics of hard solder and indium solder MCC-packaged diode lasers were conducted and analyzed. Based on the simulated results, a series of high power HSMCC packaged diode laser arrays were fabricated and characterized. The test and statistical results indicated that under the same output power the HSMCC packaged laser bar has lower smile and high reliability in comparison with the conventional copper MCC packaged laser bar using indium soldering technology.

Citation Download Citation

Jingwei Wang, Lijun Kang, Pu Zhang, Zhiqiang Nie, Xiaoning Li, Lingling Xiong, and Xingsheng Liu "High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology", Proc. SPIE 8241, High-Power Diode Laser Technology and Applications X, 82410H (8 February 2012); https://doi.org/10.1117/12.909655

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