Paper
18 February 2011 Position-controlled formation of Si nanopores by chemical vapor deposition of SiC/SOI(100)
Yoshifumi Ikoma, Hafizal Yahaya, Hirofumi Sakita, Yuta Nishino, Teruaki Motooka
Author Affiliations +
Proceedings Volume 7995, Seventh International Conference on Thin Film Physics and Applications; 79951Y (2011) https://doi.org/10.1117/12.888531
Event: Seventh International Conference on Thin Film Physics and Applications, 2010, Shanghai, China
Abstract
We investigated the position-controlled nanopore formation in the surface of thin Si layer of a Silicon on Insulator (SOI) substrate by utilizing chemical vapor deposition (CVD). The Si membrane was obtained by anisotropic etching of the handle wafer. The SiC film growth was carried out from the backside surface by utilizing CH3SiH3 pulse jet CVD at the substrate temperature of 900 °C. Square pits with the sizes of ≤0.5 μm were observed on the Si membrane while no pit was formed on the top Si layer. This result indicates that the position of the nanopores on the top Si layer can be controlled without using SiO2 masks on the front side surface.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoshifumi Ikoma, Hafizal Yahaya, Hirofumi Sakita, Yuta Nishino, and Teruaki Motooka "Position-controlled formation of Si nanopores by chemical vapor deposition of SiC/SOI(100)", Proc. SPIE 7995, Seventh International Conference on Thin Film Physics and Applications, 79951Y (18 February 2011); https://doi.org/10.1117/12.888531
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KEYWORDS
Silicon

Silicon carbide

Chemical vapor deposition

Oxides

Etching

Semiconducting wafers

Anisotropic etching

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