Etching spin-on trilayer masks

David J. Abdallah; Shinji Miyazaki; Aritaka Hishida; Allen Timko; Douglas McKenzie; Dalil Rahman; WooKyu Kim; Lyudmila Pylneva; Hengpeng Wu; Ruzhi Zhang; Ping-Hung Lu; Mark Neisser; Ralph Dammel

doi:10.1117/12.772691

15 April 2008 Etching spin-on trilayer masks

David J. Abdallah, Shinji Miyazaki, Aritaka Hishida, Allen Timko, Douglas McKenzie, Dalil Rahman, WooKyu Kim, Lyudmila Pylneva, Hengpeng Wu, Ruzhi Zhang, Ping-Hung Lu, Mark Neisser, Ralph Dammel

Author Affiliations +

Proceedings Volume 6923, Advances in Resist Materials and Processing Technology XXV; 69230U (2008) https://doi.org/10.1117/12.772691
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

Spin-on trilayer materials are increasingly being integrated in high density microfabrication that use high NA ArF lithography due to dwindling photoresist film thicknesses, lower integration cost and reduced complexity compared to analogous CVD stacks. To guide our development in spin-on trilayer materials we have established etch conditions on an ISM etcher for pattern transfer through trilayer hard masks. We report here a range of etch process variables and their impact on after-etch profiles and etch selectivity with AZ trilayer hard mask materials. Trilayer pattern transfer is demonstrated using 1st and 2nd minimum stacks with various pattern types. Etch recipes are then applied to blanket coated wafers to make comparisons between etch selectivities derived from patterned and blanket coated wafers.

Citation Download Citation

David J. Abdallah, Shinji Miyazaki, Aritaka Hishida, Allen Timko, Douglas McKenzie, Dalil Rahman, WooKyu Kim, Lyudmila Pylneva, Hengpeng Wu, Ruzhi Zhang, Ping-Hung Lu, Mark Neisser, and Ralph Dammel "Etching spin-on trilayer masks", Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69230U (15 April 2008); https://doi.org/10.1117/12.772691

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