Paper
13 November 1998 Use of novel photoresists in the production of submillimeter-wave integrated circuits
Chris Collins, Robert E. Miles, G. M. Parkhurst, John W. Digby, H. Kazemi, J. Martyn Chamberlain, R. D. Pollard, N. J. Cronin, Steven R. Davies, John W. Bowen, David Paul Steenson
Author Affiliations +
Abstract
A new technique is reported for micro-machining millimeter and submillimeter-wave rectangular waveguide components using an advanced thick film UV photoresist known as EPONTM SU-8. The recent introduction of this resist has been of great interest to the millimeter-wave and terahertz micro-machining communities, as it is capable of producing features up to 1 mm in height with very high aspect ratios in only a single UV exposure. It therefore represents a possible low-cost alternative to the LIGA process. S-parameter measurements on the new rectangular waveguides show that they achieve lower loss than those produced using other on-chip fabrication techniques, they have highly accurate dimensions, are physically robust, and cheap and easy to manufacture.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chris Collins, Robert E. Miles, G. M. Parkhurst, John W. Digby, H. Kazemi, J. Martyn Chamberlain, R. D. Pollard, N. J. Cronin, Steven R. Davies, John W. Bowen, and David Paul Steenson "Use of novel photoresists in the production of submillimeter-wave integrated circuits", Proc. SPIE 3465, Millimeter and Submillimeter Waves IV, (13 November 1998); https://doi.org/10.1117/12.331184
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Cited by 3 scholarly publications.
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KEYWORDS
Waveguides

Photoresist materials

Fabrication

Micromachining

Ultraviolet radiation

Integrated circuits

Manufacturing

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