Paper
1 April 2024 Analysis of improving the straightness of slender and thin-walled slot waveguides by pre-stressed reverse deformation
Manyi Zhang, Qiuci Zhao
Author Affiliations +
Proceedings Volume 13081, Third International Conference on Advanced Manufacturing Technology and Electronic Information (AMTEI 2023); 1308106 (2024) https://doi.org/10.1117/12.3025900
Event: 2023 3rd International Conference on Advanced Manufacturing Technology and Electronic Information (AMTEI 2023), 2023, Tianjin, China
Abstract
This paper analyzes the reasons for machining deformation from the production process, physical characteristics and other factors of slender and thin-walled waveguides. The LS-DYNA explicit analysis was used to simulate the reverse deformation of pre-stress in slender thin-walled waveguides, and the ANSYS implicit analysis was used to simulate the rebound state after unloading. The application practice has verified the effectiveness, reliability and accuracy of the new process in improving the straightness of slender and thin-walled slot waveguides.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Manyi Zhang and Qiuci Zhao "Analysis of improving the straightness of slender and thin-walled slot waveguides by pre-stressed reverse deformation", Proc. SPIE 13081, Third International Conference on Advanced Manufacturing Technology and Electronic Information (AMTEI 2023), 1308106 (1 April 2024); https://doi.org/10.1117/12.3025900
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KEYWORDS
Deformation

Waveguides

Antennas

Elasticity

Design

Bending stress

Materials properties

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