Preparing for cost-effective soft x-ray metrology for 3D chip architecture

Henry Chou; Don McDaniel; Debbie Gustafson; Chris Lee; David Reisman

doi:10.1117/12.3004518

3 October 2023 Preparing for cost-effective soft x-ray metrology for 3D chip architecture

Henry Chou, Don McDaniel, Debbie Gustafson, Chris Lee, David Reisman

Proceedings Volume 12695, Advances in Metrology for X-Ray and EUV Optics X; 126950E (2023) https://doi.org/10.1117/12.3004518
Event: SPIE Optical Engineering + Applications, 2023, San Diego, California, United States

Conference Poster

Abstract

The soft x-ray regime is gaining adoption, specifically for the extreme ultraviolet (EUV) 13.5 nm wavelength used in today’s leading-edge semiconductor chip manufacturing. As miniaturization progresses and with the goal of continuing Moore’s Law, it becomes more difficult for chip makers to increase device densities in a 2D plane, even with leading-edge EUV photolithography. Chip makers are now turning to 3D-stacked architectures to increase area density. Since these stacked layers consist of micro-features and require precise interconnections, it is imperative that proper metrology be performed on each layer to identify possible defects and optimize the process on subsequent layers. There is a need for non-destructive imaging tools that can resolve nanometer-sized features. Soft x-ray imaging could be a solution using wavelengths from 2-20 nm. There are many methods of generating soft x-ray light, often with relatively high costs and varying outputs. This talk will highlight some cost-effective components that are commercially available. We will also present simulations of effective soft x-ray light output at the sample.

Citation Download Citation

Henry Chou, Don McDaniel, Debbie Gustafson, Chris Lee, and David Reisman "Preparing for cost-effective soft x-ray metrology for 3D chip architecture", Proc. SPIE 12695, Advances in Metrology for X-Ray and EUV Optics X, 126950E (3 October 2023); https://doi.org/10.1117/12.3004518

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