High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder

Jingwei Wang; Yanfang Zheng; Yang Han; Tuanwei Fu; Dong Hou; Xingsheng Liu

doi:10.1117/12.2687224

27 November 2023 High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder

Jingwei Wang, Yanfang Zheng, Yang Han, Tuanwei Fu, Dong Hou, Xingsheng Liu

Proceedings Volume 12761, Semiconductor Lasers and Applications XIII; 127610N (2023) https://doi.org/10.1117/12.2687224
Event: SPIE/COS Photonics Asia, 2023, Beijing, China

Abstract

The high reliability and efficiency of high-power conduction cooled annular diode laser stack are critical to the side pump solid-state laser head in a DPSSL system. To obtain the higher reliability and efficiency, a high-power conduction cooled annular diode laser stack packaged by AuSn hard solder has been presented. The CTE-matched wedge-shaped submounts are designed and applied in bonding GaAs-based diode laser bars with the cavity length of 1.5 mm on a conduction cooled annular heatsink. The mechanical structural design and thermal design are conducted to evaluate the capability of the annular packaging. The bar bonding process is optimized to reduce the thermal stress and improve the spectral performances of this package. After optimizing the multiple bar bonding process, a series of 808nm QCW ⪆2000W annular diode laser stacks with a narrow spectral width are achieved, which has the average FWHM and FW90%Energy value of approximately 2.6 nm and approximately 3.6 nm at 65 °C, respectively. Also, the FW90% Energy value at 65 °C is significantly reduced from 8.03 nm to 3.84 nm. Of particular importance is the elimination of the left shoulder of the spectral profile after optimizing the multiple bar bonding process.

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Jingwei Wang, Yanfang Zheng, Yang Han, Tuanwei Fu, Dong Hou, and Xingsheng Liu "High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder", Proc. SPIE 12761, Semiconductor Lasers and Applications XIII, 127610N (27 November 2023); https://doi.org/10.1117/12.2687224

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