Using ANSYS analyse to predict laser of flip chip packaging

Huang Peng; Yichia Lin; Zuoqian Yu

doi:10.1117/12.2686798

6 August 2023 Using ANSYS analyse to predict laser of flip chip packaging

Huang Peng, Yichia Lin, Zuoqian Yu

Proceedings Volume 12781, International Conference on Optoelectronic Information and Functional Materials (OIFM 2023); 127811I (2023) https://doi.org/10.1117/12.2686798
Event: 2023 International Conference on Optoelectronic Information and Functional Materials (OIFM 2023), 2023, Guangzhou, JS, China

Abstract

The main focus of this study is to use the flip chip model and the finite element analysis software ANSYS to predict the temperature field and stress field distribution generated in laser micro-welding. The moving Gaussian heat source is used as the heat source model of loading. The results of transient thermal analysis show that the minimum temperature is greater than the eutectic temperature of 63Sn-37Pb solder, and the temperature decreases from the laser motion path to the surrounding. The results of thermo-mechanical coupling analysis show that when the laser moving speed decreases, the equivalent stress and deformation increase, and higher temperature is generated at the same time.

Citation Download Citation

Huang Peng, Yichia Lin, and Zuoqian Yu "Using ANSYS analyse to predict laser of flip chip packaging", Proc. SPIE 12781, International Conference on Optoelectronic Information and Functional Materials (OIFM 2023), 127811I (6 August 2023); https://doi.org/10.1117/12.2686798

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