Analysis of vibration causes of large aperture wafer under vertical support

Ying Yang; Yuhang Shen; Wujun Lv; Linghua Zhang; Sen Han; Manlin Han; Jingming Guo; Chenxi Gong

doi:10.1117/12.2686769

27 November 2023 Analysis of vibration causes of large aperture wafer under vertical support

Ying Yang, Yuhang Shen, Wujun Lv, Linghua Zhang, Sen Han, Manlin Han, Jingming Guo, Chenxi Gong

Proceedings Volume 12769, Optical Metrology and Inspection for Industrial Applications X; 127690N (2023) https://doi.org/10.1117/12.2686769
Event: SPIE/COS Photonics Asia, 2023, Beijing, China

Abstract

The vibration of wafers can significantly impact the accuracy and efficiency of wafer inspection, especially when the wafer is placed vertically. And the larger the wafer size, the thinner the thickness, the more obvious its vibration. To improve the efficiency and accuracy of wafer inspection, and also to make wafer inspection more adaptable to the complex inspection environment and reduce the cost of inspection, this study through a large number of experiments to find out the main factors that lead to vibration of the vertically placed wafers, such as temperature changes, mechanical vibration, environmental disturbance, airflow disturbance, and fluid-solid coupling. The main method is to analyze the vibration law of the wafer through the vibration of the interference fringes produced when the wafer is affected by different disturbing factors during the interferometry process. After effectively controlling the above interference factors in the wafer inspection process, the practical data of wafer surface shape can be measured continuously and stably.

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Ying Yang, Yuhang Shen, Wujun Lv, Linghua Zhang, Sen Han, Manlin Han, Jingming Guo, and Chenxi Gong "Analysis of vibration causes of large aperture wafer under vertical support", Proc. SPIE 12769, Optical Metrology and Inspection for Industrial Applications X, 127690N (27 November 2023); https://doi.org/10.1117/12.2686769

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KEYWORDS

Semiconducting wafers

Vibration

Environmental sensing

Turbulence

Wafer inspection

Laboratories

Interferometry

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