Overlay performance in permanent bonded wafer integration schemes

Nathan Ip; Michael Belyansky; Christopher Netzband; Norifumi Kohama; Richard Johnson; Shobha Hosadurga; Jack Wong; John Arnold; Kisik Choi; Wai Kin Li; Indira Seshadri; Luciana Meli; Ilseok Son

doi:10.1117/12.2654679

27 April 2023 Overlay performance in permanent bonded wafer integration schemes

Nathan Ip, Michael Belyansky, Christopher Netzband, Norifumi Kohama, Richard Johnson, Shobha Hosadurga, Jack Wong, John Arnold, Kisik Choi, Wai Kin Li, Indira Seshadri, Luciana Meli, Ilseok Son

Author Affiliations +

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 1249618 (2023) https://doi.org/10.1117/12.2654679
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

Several next generation integration schemes – e.g. for 3D stacked transistors, backside power distribution, and advanced packaging involve permanent wafer bonding steps and drive to sub-10nm overlay requirements post bonding. Distortion during wafer bonding is a major determinant of best achievable overlay between post to pre bonding lithography layers. Here, we investigate correlations between wafer bonding process and post bonding overlay performance through a combination of experiment and modelling. We use a custom test vehicle to collect wafer distortion data from pre- and post-bond processes, as well as overlay data after the post-bond processing steps (anneal and thin). The results establish direct relationships between incoming wafer distortion, bonder-induced distortion and post-bond lithography overlay to a pre-bond level. We also use the experimental results to validate a wafer bonding simulation model to further physical explanation of process-induced distortion. The experiment results will enable advanced wafer bonding process controls to optimize distortion and scanner overlay to meet technology targets. The results will also help guide hardware design to improve distortion fingerprints to best improve scanner overlay, as well as address the distortion challenges from incoming wafers.

Conference Presentation

Citation Download Citation

Nathan Ip, Michael Belyansky, Christopher Netzband, Norifumi Kohama, Richard Johnson, Shobha Hosadurga, Jack Wong, John Arnold, Kisik Choi, Wai Kin Li, Indira Seshadri, Luciana Meli, and Ilseok Son "Overlay performance in permanent bonded wafer integration schemes", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 1249618 (27 April 2023); https://doi.org/10.1117/12.2654679

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available