Fabrication of SiCp/Al composites electronic packaging components by centrifugal casting and their microstructure

Xuedong Lin; Changming Liu; Linxian Che

doi:10.1117/12.2652411

10 November 2022 Fabrication of SiC_p/Al composites electronic packaging components by centrifugal casting and their microstructure

Xuedong Lin, Changming Liu, Linxian Che

Author Affiliations +

Proceedings Volume 12331, International Conference on Mechanisms and Robotics (ICMAR 2022); 123311F (2022) https://doi.org/10.1117/12.2652411
Event: International Conference on Mechanisms and Robotics (ICMAR 2022), 2022, Zhuhai, China

Abstract

The centrifugal casting method was introduced to successfully fabricate the SiCp/Al composites electronic packaging components. Three zones including the SiC particle segregation zone, matrix alloy region and inclusion collecting zone were observed on the cross section of the casting due to the SiC particles in the slurry migrating towards the centrifugal force direction while the inclusions segregating to the revolving axis in the centrifugal field. The macro-morphologies and the microstructures of the castings were observed. The results show that the electronic packaging components obtained from the particle segregation zone has a dense structure and a uniform distribution of SiC particles. Especially, the leading-out wire holes on the components were directly formed during the centrifugal casting process. The castings had the most remarkable segregation of SiC particles, the volume fraction of SiC particles in the particle segregation zone can reach the largest value of 61%.

Citation Download Citation

Xuedong Lin, Changming Liu, and Linxian Che "Fabrication of SiC_p/Al composites electronic packaging components by centrifugal casting and their microstructure", Proc. SPIE 12331, International Conference on Mechanisms and Robotics (ICMAR 2022), 123311F (10 November 2022); https://doi.org/10.1117/12.2652411

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