Presentation
5 March 2021 Photonic integration: from wafer level to the module
Author Affiliations +
Abstract
Photonics integration continues to be a main driver for innovation in multiple aspects, including wafer-scale integration, new materials, sub-micron alignment of components and protection from harsh environment. We show cost-effective fabrication technologies of micro-optical components by UV wafer-scale replication into chemically stable polymers. Furthermore, for simplified fiber coupling and packaging, a novel 90° optical interconnect is presented, integrated with self-alignment structures. Replicated, space compliant microlenses on packaged CMOS imagers show improved light sensitivity by a factor 1.8. A laser based, low stress bonding process is explored to generate wafer-scale hermetic enclosures for harsh environment applications ranging from space to implants.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christian Bosshard, Rolando Ferrini, Stefan Mohrdiek, Oscar Fernandez, Ton Offermans, Roger Krähenbühl, Angelique Luu-Dinh, Frederic Zanella, Guillaume Basset, Rony Jose James, Mark Fretz, Guido Spinola Durante, and Amir Ghadimi "Photonic integration: from wafer level to the module", Proc. SPIE 11692, Optical Interconnects XXI, 116920Q (5 March 2021); https://doi.org/10.1117/12.2578669
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KEYWORDS
Semiconducting wafers

Ultraviolet radiation

Microlens

Silicon carbide

Standards development

Structured optical fibers

Thermography

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