Presentation + Paper
5 March 2021 Thermally stable single-mode glass waveguides with fiber connectors for co-packaged optics
Lars Brusberg, Jason R. Grenier, Matthew J. Dejneka, Chad C. Terwilliger, Katerina Rousseva
Author Affiliations +
Abstract
Co-packaged optics for next-generation data center switches require novel photonic packaging and optical interconnect solutions to increase bandwidth and decrease manufacturing costs. An optoelectronic glass substrate with integrated ion-exchanged (IOX) single-mode waveguides for photonic integrated circuit (PIC) packaging and fiber cable connectivity is demonstrated in an effort to reduce the overall packaging complexity. The single-mode glass waveguides were fabricated and evaluated to be thermally stable at 110ºC for more than 5 years. Laser singulated optical end-facets and laser-formed passive alignment features yield an average connector loss of 0.68 dB when end-coupled to standard MTP- 16™ connectors.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lars Brusberg, Jason R. Grenier, Matthew J. Dejneka, Chad C. Terwilliger, and Katerina Rousseva "Thermally stable single-mode glass waveguides with fiber connectors for co-packaged optics", Proc. SPIE 11692, Optical Interconnects XXI, 116920K (5 March 2021); https://doi.org/10.1117/12.2578654
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KEYWORDS
Waveguides

Glasses

Connectors

Refractive index

Single mode fibers

Packaging

Integrated optics

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