A theoretical model for predicting LED product lifetime based on solder joint failure

Dinusha R. Thotagamuwa; Nadarajah Narendran; Yi-wei Liu; Xi Mou

doi:10.1117/12.2508001

1 April 2019 A theoretical model for predicting LED product lifetime based on solder joint failure

Dinusha R. Thotagamuwa, Nadarajah Narendran, Yi-wei Liu, Xi Mou

Proceedings Volume 10940, Light-Emitting Devices, Materials, and Applications; 109401Q (2019) https://doi.org/10.1117/12.2508001
Event: SPIE OPTO, 2019, San Francisco, California, United States

Abstract

LED A-lamps are used in many types of lighting fixtures; however, these lamps can experience different thermal environments and use patterns (on-off switching), resulting in system life that varies in different applications. A recent study showed that on-off switching negatively affects LED system lifetime, and solder joint failure was the main reason. The goal of this study was to investigate and identify a theoretical model that can be used to predict LED A-lamp failure, when the failure is mainly due to solder joint failure. Although several models for solder joint fatigue failure exist in the electronics industry, the Engelmaier model is the most commonly used in industry standards. The study presented here showed that the Engelmaier model with modified fatigue ductility exponents provided a better fit to the experimental lifetime data for LED A-lamps. This paper describes the Engelmaier model prediction method for LED A-lamp failure.

Citation Download Citation

Dinusha R. Thotagamuwa, Nadarajah Narendran, Yi-wei Liu, and Xi Mou "A theoretical model for predicting LED product lifetime based on solder joint failure", Proc. SPIE 10940, Light-Emitting Devices, Materials, and Applications, 109401Q (1 April 2019); https://doi.org/10.1117/12.2508001

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