New method of thermal placement in hybrid circuits

Andrzej Kos

doi:10.1117/12.131043

1 August 1992 New method of thermal placement in hybrid circuits

Andrzej Kos

Proceedings Volume 1783, International Conference of Microelectronics: Microelectronics '92; (1992) https://doi.org/10.1117/12.131043
Event: International Conference on Microelectronics, 1992, Warsaw, Poland

Abstract

The paper deals with the quasi-optimum placement and temperature estimation of heat dissipating components in hybrid power circuits. A placement is found when the extreme temperatures on the substrate are minimized. Whereas classical techniques require large computational effort, a method presented in this paper is simple and rapid. It couples two main ideas: a heuristic approach to the placement problem and a neural computation of temperature.

Citation Download Citation

Andrzej Kos "New method of thermal placement in hybrid circuits", Proc. SPIE 1783, International Conference of Microelectronics: Microelectronics '92, (1 August 1992); https://doi.org/10.1117/12.131043

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