AIM announces Sn63LT alloy for reducing tombstoning

AIM announces Sn63LT alloy for reducing tombstoning

AIM announces Sn63LT alloy for reducing tombstoning

Keywords: AIM

AIM has announced the availability of the Sn63LT alloy, a unique pasty range alloy designed to dramatically reduce the tombstoning of small discrete components.

Sn63LT contains a blend of two different solder alloys, resulting in an extended liquidus time of the paste during the reflow process. This increases the time available to wet each end of the component, allowing both ends of the component extended time to stabilize thermally prior to being soldered. This increased thermal stability reduces the likelihood of one component termination end becoming soldered before the other, thus preventing tombstoning.

Sn63LT has peak melting ranges within 108C of each other, allowing it to be processed with the same temperature profile as standard Sn63/Pb37 solder paste. Not having to modify, reflow profiles save time and ensure a stable reflow process. Industry testing has demonstrated that solder joints formed using a pasty range alloy exhibit equivalentstrength to those manufactured with Sn63/Pb37.