TechSearch International's study shows Japanese companies dominate microvia production

TechSearch International's study shows Japanese companies dominate microvia production

TechSearch International's study shows Japanese companies dominate microvia production

Keywords Microvias, Japan, TechSearch

According to TechSearch International's recent study, High-density Microvia Substrates: Markets, Applications, and Infrastructure, Japanese companies dominate the microvia technology market with more than 50 percent of worldwide production capacity.

This domination exists because many Japanese companies were motivated to use a combination of fine-pitch, chip-scale packages and microvia boards to meet domestic consumer product and mobile phone miniaturization requirements. Surprisingly, European companies rank second in microvia board production capacity with investment enabled by Europe's dominating telecommunications industry, which uses microvia technology for mobile phones. Major investments in microvia technology have also been made by Taiwanese companies (led by Taiwanese government/industry programs), by Korean companies, and by other Asian companies. In terms of production capacity, US companies are in last place behind Japan, Europe, and the Asia/Pacific region. A few US companies target mobile phones, but most aim at high-value applications such as workstation/servers and network systems, which will not see volume production until 2000 and beyond.

TechSearch International's study finds more than 75 companies worldwide with microvia capability. Laser and photovia processes are used for most microvia production, with 70 percent of the world's microvia production capacity based on laser-ablated vias.

The study finds two distinct markets for microvia technology: product boards and IC package substrates. These markets have distinctly different drivers, reliability requirements, and price structures.

Mobile phones are the largest market for microvia technology in product boards, and microvia boards are expected to be used increasingly in digital cellular phones as denser packaging of fine-pitch CSP and BGA parts becomes critical. Digital camcorders and cameras also depend on microvia board technology to meet form factor requirements dictated by the marketplace. Notebook computer makers have found the need for microvia boards in their notebook and handheld products. Workstation/server and network system makers are expected to use the technology in future systems.

ASIC and microprocessor makers are using packages incorporating microvia technology. The drivers for the use of microvia technology in IC packages are high I/O counts coupled with decreasing flip-chip-bump pitch. Japanese companies dominate the substrate business, but a number of US companies are investing in microvia technology for IC package substrates.

TechSearch International predicts strong growth in the microvia technology market. The combined markets for IC package substrates and product boards incorporating microvia technology will be more than $1.6 billion in 1999 and is expected to grow to more than $8.6 billion in 2005. US companies' share of this market will depend on the timing and amount of their investment, which will in turn determine their ability to compete in the global marketplace.

For more information, contact TechSearch. Tel: +1 512 372-8887; Fax: +1 512 372-8889: WWW: http//www.techsearchinc.com