Polyimide Protection of Thin Film Chip Resistors
Abstract
In hybrid technology, components (e.g., ICs, capacitors, resistor chips) are mounted onto a thin or thick film circuit. Bare chip resistors are usually incorporated into hermetically sealed hybrid circuits (die and wire bonding). Encapsulated chip resistors or chip resistors with a protective layer are required in the case of non hermetic sealing (flip chip soldering, surface mounting). The electrical performance of resistor chips with and without polyimide protective coating was investigated and is compared. This investigation was performed on NiCr based and Ta2N thin resistive films.
Citation
Diletti, H., Noser, J.R. and Sele, G.J. (1985), "Polyimide Protection of Thin Film Chip Resistors", Microelectronics International, Vol. 2 No. 4, pp. 28-31. https://doi.org/10.1108/eb044199
Publisher
:MCB UP Ltd
Copyright © 1985, MCB UP Limited